High Speed Interconnects

High Speed Interconnects, as a technology description, are evolving based on emerging compute capabilities and analysis applications. Once strictly the domain of supercomputers pushing petascale and exascale FLOPS (floating point operations per second) for military, medical or weather simulations, the term 'High Speed Interconnects' is now also associated with large aggregations of conventional GPUs performing streamlined analysis and AI (Artificial Intelligence) employed by large data centers. Supercomputers, with massive interconnect densities and tightly controlled environments, often lead the adoption of dense optical solutions, such as seen with mid-board mounted parallel fiber optics. While High Speed Interconnects usually have substantial architectural redundancies, high reliability is key to these tightly integrated systems, where serviceability may be more difficult than with conventional networks. 

High Reliability

High Reliability

Longevity and reliability are important value propositions for High Speed Interconnect applications, to meet Five Nines uptime and Ten Year mission life metrics. FIT optical product quality and reliability continue to be world class. 

Dense Form Factors

Dense Form Factors

To meet the needs of increasing High Speed Interconnect and switch, router and server interconnect densities, FIT provides a broad selection of high density mechanical, electrical and optical solutions to enable space and cabling optimization. 

Low Power Dissipation

Low Power Dissipation

One key operational expense for High Speed Interconnects is power. By using efficient FIT interconnect solutions, architects ensure the network is operated at its most optimum power envelope and lowest costs. 

Low Latency

Low Latency

FIT’s High Speed Interconnect solutions are compliant to important industry standards and multi-source agreements, but also have capabilities beyond compliance to assist low latency applications achieve their goals. 

Optimized Temperature Range

Optimized Temperature Range

To improve interconnect economics for High Speed Interconnect applications, FIT takes advantage of tightly controlled environmentals common in Supercomputing to provide solution savings. 

High Volume Production

High Volume Production

With a heritage of Avago and Foxconn, FIT has tremendous experience with high volume production of optical and copper transceivers, cables and connectors to help High Speed Interconnects scale.