Foxconn Interconnect Technology, Ltd. to Showcase 400 Gbps Interconnect Solutions at OFC 2019

SAN JOSE, Calif., Feb. 25, 2019 /PRNewswire/ -- Foxconn Interconnect Technology, Limited ("FIT"), a leading supplier of optical and copper communication products, will showcase its latest 400 Gbps interconnect solutions using featured product and technology demonstrations at the Optical Fiber Communications (OFC) Conference & Exhibition, to be held March 5-7, 2019, at the San Diego, CAConvention Center.

Live traffic demonstrations will incorporate a selection of FIT's 400G interconnect solutions including several configurations of optical transceivers, passive cables, transceiver mechanical cages and connectors that combine to deliver 400 Gbps solutions for hyper-scale data center and enterprise applications.

Conference attendees are invited to visit FIT at booth #2509 in the OFC at the San DiegoConvention Center where these 400G products and demonstrations will be on display.

QSFP-DD and OSFP product and technology demonstrations: 

QSFP-DD products: FIT will be showcasing its growing line of QSFP-DD cage, connector and interconnect products.

"FIT is in process of commercializing 400 Gbps products and technologies that will add to one of the broadest portfolios of optical transceivers, cages/connectors, DAC and ACC on the market. The product and technology showcases taking place at this year's OFC demonstrate both our commitment to the QSFP-DD and OSFP form factors, and our position as a market and technology leader for data center applications," said Adam Carter, Chief Commercial Officer at FIT's Fiber Optics Communications Business.

Availability

FIT is currently sampling various configurations of QSFP-DD optical transceivers, DAC, cages, connectors and cables to the customers. For more information, visit https://www.foit-foxconn.com/ or follow on Twitter at @FITOptics

About Foxconn Interconnect Technology 

Foxconn Interconnect Technology Limited ("FIT") focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products. The FIT Optics division (FOIT), is responsible for the commercial development and production of high speed fiber optic transceivers and solutions.