Foxconn Interconnect Technology, Ltd. to Showcase 400 Gbps Interconnect Solutions at OFC 2018

SAN JOSE, Calif., March 13, 2018 /PRNewswire/ -- Foxconn Interconnect Technology, Limited ("FIT"), a leading supplier of optical and copper products, will showcase its latest 400 Gbps Interconnect solutions in featured product and technology demonstrations at the Optical Fiber Communications (OFC) Conference & Exhibition, to be held March 13-15, 2018, at the San Diego, CA Convention Center.

The live traffic demonstrations will incorporate a selection of FIT's 400G interconnect solutions that include various configurations of optics, cables, cages and connectors that combine to deliver 400 Gbps solutions.

Conference attendees are invited to visit FIT at booth #1523-CV in the OFC corporate village at the San Diego Convention Center where the 400G products and demonstrations will be on display.

QSFP-DD product and technology demonstrations:

QSFP-DD products: FIT will be showcasing its growing line of QSFP-DD cage, connector and interconnect products.

"FIT is committed to the development of 50G, 100G and 400G PAM4 based products and technologies that will add to one of the broadest portfolios of transceivers, cages/connectors, direct attach copper (DAC), and active optical cables (AOC) on the market. The product and technology showcases that will take place at this year's OFC demonstrate both our commitment to the QSFP-DD and OSFP MSA's, and our position as a market and technology leader," said Steve Shultis, Senior Director of Product Marketing at Foxconn Interconnect Technology.

Availability

FIT is currently sampling various configurations of QSFP-DD cages, connectors and cables while sampling of optical transceiver products is planned for the second half of 2018.

Additional FIT solutions to be showcased at booth #1523-CV include:

About Foxconn Interconnect Technology

Foxconn Interconnect Technology Limited ("FIT") focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products. The FIT Optics division (FOIT) is responsible for the commercial development and production of high speed fiber optic transceivers and solutions.