Foxconn Interconnect Technology, Ltd. Announces General Availability of 100G BiDi Fiber Optic Transceiver Module

SAN JOSE, Calif., March 12, 2018 /PRNewswire/ -- Foxconn Interconnect Technology, Limited ("FIT"), a leading supplier of optical communications solutions, today announced the general availability of its 100 Gbps Bidirectional (100G BiDi) QSFP28 multimode fiber (MMF) transceiver module for 100 Gigabit Ethernet Applications. The module is designed to facilitate an easy upgrade path from 10 Gbps or 40 Gbps line rates to 100 Gbps by reusing existing duplex LC MMF fiber cable infrastructure. The 100G BiDi modules support link distances up to 70m OM3, 100m OM4, and 150m OM5 MMF.

The 100G BiDi transceiver offers many advantages compared to alternative solutions, including:

"Our 40G BiDi transceiver has been a major success for end customers seeking to reuse their duplex LC MMF fiber infrastructure. It has been widely adopted and is still in high demand. The new 100G BiDi transceiver module leverages proven BiDi technology and builds upon the 40G success story by offering a higher speed product that we believe to be better choice than SWDM4," said Steve Shultis, Senior Director of Product Marketing in FIT's Fiber Optics Communications Business. "Our customers demand high reliability and choosing our BiDi module for 100 Gbps optical connectivity will result in both a lower overall solution cost, and less risk than comparable solutions, which use more lasers and stretch cable capabilities."

About Foxconn Interconnect Technology

Foxconn Interconnect Technology Limited ("FIT") focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products. The FIT Optics division (FOIT) is responsible for the commercial development and production of high speed fiber optic transceivers and solutions.